• Waterproof silicone potting for electronics damp proof encapsulation such as PCB circuit board

Waterproof silicone potting for electronics damp proof encapsulation such as PCB circuit board

  • Product Usage: Glue silicone rubber is perfect for covering PCB electronic circuit boards, it's generally used in all kinds of control modules, and the components are generally poured in order to achieve the basic requirements of moisture-proof, anti-fouling and anti-corrosion
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Description

INTRODUCTION

        At present, water proof dump proof silicone potting is widely used in motor controller, power supply, computer and automotive electronics. In addition, chip cooling such as military supplies usually involves contact cooling of electronic devices or mechanical structures. It is used to reduce contact thermal resistance and enhance heat transfer at the contact interface, which will directly improve the performance, accuracy and reliability of the equipment or system itself


        It should be said that the market prospect of heat dissipation silicone rubber is still very good. Heat dissipation silicone rubber can be used in consumer electronics, communication equipment, industrial electronic equipment, military industry and other fields, and its demand can be imagined. In the era of communication and information, its future market is very broad. With the economic revolution, the market demand for heat dissipation silicone is even greater.



APPLICATION

        Glue silicone rubber is perfect for covering PCB electronic circuit boards, it's generally used in all kinds of control modules, and the components are generally poured in order to achieve the basic requirements of moisture-proof, anti-fouling and anti-corrosion. Silicone sealant can reduce stress and withstand high and low temperature impact. For the high power control module, thermal conductive sealing glue is used to achieve the function of heat dissipation.


         Silicone rubber glue for covering PCB electronic circuit board is widely used in the field of encapsulation, filling, bonding, impregnation and coating. It can encapsulate integrated circuits, micro-film components, thick film components, electronic assemblies or the whole machine. The components in the adhesive layer are clearly visible, and the parameters of components can be accurately measured.


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